BONDEXPO

BONDexpo trade fair for industrial bonding technologies plays a significant role in complementary trade fairs consisting of MOTEK, BONDexpo and MICROSYS. With the successful establishment of BONDexpo as a trade fair in the fields of bonding, encapsulation, foaming and sealing in production, and above all in assembly processes, private trade fair promoter Paul E. Schall has one again proven his “very good nose” for the development of future markets. After expanding into new dimensions at the last event in the fall of 2011 with more than 100 exhibitors and exhibition floor space amounting to 37,500 square feet, the 6th BONDexpo, taking place at the Stuttgart Exhibition Centre from the 8th through the 11th of May, is once again expecting considerable growth.